Local anodic bonding of Kovar to Pyrex aimed at high-pressure, sovent-resistant microfluidic connections

Authors
  • M.T. Blom
  • E. Chmela
  • J.G.E. Gardeniers
  • J.W. Berenschot
  • M. Elwenspoek
  • R. Tijssen
  • A. van den Berg
Publication date 2001
Journal Journal of Micromechanics and Microengineering
Volume | Issue number 11 | 4
Pages (from-to) 382-385
Organisations
  • Faculty of Science (FNWI) - Van 't Hoff Institute for Molecular Sciences (HIMS)
Abstract
Local anodic bonding of a common Kovar alloy to Pyrex is presented. This technique is ideally suitable for temperature-, solvent- and pressure-resistant microfluidic connections. In this paper we mainly concentrate on the stress problems occurring during and after bonding. Because of the different thermal expansion coefficients of Kovar and Pyrex a structure is added in order to release the thermal stresses induced during bonding. Optimum bonding conditions in vacuum on Pyrex and on a Pyrex-Si bonded wafer pair are investigated. In the latter case bonding for 3 h at 250 °C and 1.5 kV results in a high-quality bond.
Document type Article
Language English
Published at https://doi.org/10.1088/0960-1317/11/4/317
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