Folding of a Zinc-Finger ββα-Motif Investigated Using Two-Dimensional and Time-Resolved Vibrational Spectroscopy
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| Publication date | 03-11-2016 |
| Journal | The journal of Physical Chemistry. B |
| Volume | Issue number | 120 | 43 |
| Pages (from-to) | 11151-11158 |
| Number of pages | 8 |
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| Abstract |
Small proteins provide good model systems for studying the fundamental
forces that control protein folding. Here, we investigate the folding
dynamics of the 28-residue zinc-finger mutant FSD-1, which is designed
to form a metal-independent folded ββα-motif, and which provides a
testing ground for proteins containing a mixed α/β fold. Although the
folding of FSD-1 has been actively studied, the folding mechanism
remains largely unclear. In particular, it is unclear in what stage of
folding the α-helix is formed. To address this issue we investigate the
folding mechanism of FSD-1 using a combination of temperature-dependent
UV circular dichroism (UV-CD), Fourier transform infrared (FTIR)
spectroscopy, two-dimensional infrared (2D-IR) spectroscopy, and
temperature-jump (T-jump) transient-IR spectroscopy. Our UV-CD
and FTIR data show different thermal melting transitions, indicating
multistate folding behavior. Temperature-dependent 2D-IR spectra
indicate that the α-helix is the most stable structural element of
FSD-1. To investigate the folding/unfolding re-equilibration dynamics of
FSD-1, the conformational changes induced by a nanosecond T-jump are probed with transient-IR and transient dispersed-pump–probe (DPP) IR spectroscopy. We observe biexponential T-jump
relaxation kinetics (with time constants of 80 ± 13 ns and 1300 ± 100
ns at 322 K), confirming that the folding involves an intermediate
state. The IR and dispersed-pump–probe IR spectra associated with the
two kinetic components suggest that the folding of FSD-1 involves early
formation of the α-helix, followed by the formation of the β-hairpin and
hydrophobic contacts.
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| Document type | Article |
| Note | With supplementary file. |
| Language | English |
| Published at | https://doi.org/10.1021/acs.jpcb.6b08883 |
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